Truphone and STMicroelectronics Launch eSIM Solution

GSMA-compliant end-to-end ecosystem is available for industrial IoT and automotive customers

Truphone and STMicroelectronics Launch eSIM Solution

Today, Truphone announces a collaboration with STMicroelectronics to launch a full-stack embedded SIM (eSIM) infrastructure solution – compliant with GSMA Machine-to-Machine (M2M) standards – for Industrial IoT and automotive customers.

The collaboration will see Truphone and ST combine their unique technical offering to create an end-to-end ecosystem. ST provides its ST4SIM-200A/M – a GSMA-certified SOC solution with embedded SIM (eSIM) software and industrial and automotive-qualified secure hardware – while Truphone provides its seamless connectivity and remote SIM provisioning (RSP) capabilities.

Because the eSIM can store multiple profiles on one chip, IoT devices can ship with a SIM profile containing a small amount of connectivity built in a Bootstrap profile. This is crucial for activating these devices remotely or where no interface is available.

As a trusted connectivity partner, Truphone will be offering its Bootstrap connectivity to customers purchasing ST’s eSIM solutions. Bootstrap is especially suited to Truphone as its global network allows devices to be activated anywhere in the world, out of the box. This provides for a more efficient supply chain—enabling device makers to confidently manufacture eSIM-enabled devices in a single production line, safe in the knowledge they will connect anywhere.

In using Truphone’s eSIM profiles, users will have complete oversight of their entire eSIM fleet from a single source—which provides connectivity in over 190 countries and works with all network types (2G, 3G, LTE and LPWAN).

Combining Truphone’s state-of-the-art RSP, eSIM profiles and Bootstrap connectivity with ST’s ST4SIM solutions gives users the complete eSIM package through one simple journey. OEMs, for instance, will be able to purchase an eSIM, connectivity, and a profiling system all at once, from two of the industry’s leading providers.  

Truphone’s RSP is completely interoperable with other vendors and can be activated either on the day of purchase or at a later date, depending on preference. 

Ralph Steffens, CEO Truphone said: “We’re delighted to be working with our long-standing partner, ST Microelectronics, to provide a smooth and simple connectivity solution for our customers. At Truphone, we believe connecting things, people and businesses shouldn’t be complicated. That’s why we develop technology that is truly plug-and-play. In combining our technology with that of ST Microelectronics’, we are offering OEMs the full eSIM stack.”

Laurent Degauque, Marketing Director, Secure Microcontroller Division at STMicroelectronics said: “Through our collaboration with Truphone, customers get access to end-to-end eSIM solutions that are secure and easy to use, advancing Industry 4.0 connectivity.”

About Truphone

Truphone believes that connectivity can be easier, smarter and more efficient. Since 2006, we have built state of the art SIM software, intuitive management platforms and a powerful global network to make this a reality.

Every day, our technicians engineer better connections between things, people and business to make the world smarter. Headquartered in London, we have 12 offices across four continents and continue to expand globally. To learn more, visit

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